Director, HBM SoC Design

Company: Micron Technology
Location: Richardson
Posted on: March 10, 2026

Job Description:

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As the Director of HBM SoC Design, you will lead a team of HBM SoC Design Engineers within the Heterogeneous Integration Group (HIG). Your team will be responsible for the design, development, and integration of digital and analog circuits for the next generation of HBM products. You will collaborate with Micron’s global design and verification teams and support groups such as Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to proactively design HBM products that optimize manufacturing functions and ensure the best performance, power, cost, quality, reliability, time-to-market, and customer satisfaction. Key Responsibilities • Develop innovative HBM solutions with new memory subsystem frameworks targeting AI/ML applications. • Lead the design and development of HBM base die SoC solutions, including top-level design, verification, and integration of various IP blocks. • Ensure HBM products are best-in-class for speed, power, cost, quality, and reliability by collaborating with HBM engineering teams. • Work with HBM Engineering, Marketing, Probe, Assembly, Test, Process Integration, and Manufacturing groups to ensure accurate manufacturability of products. • Lead and collaborate with physical build, layout, and verification teams to deliver high-quality, timely work, including initial tape-out and build revisions. • Debug and identify root causes and solutions for pre-silicon and post-silicon issues in HBM products. • Create architectural specifications and external-facing documents, working with partners to generate specifications considering various hardware and protocol standards. • Build a team culture of innovation, accountability, and strong global collaboration with a focus on Micron’s Values. Qualifications • Proven experience leading highly technical SoC design teams in a multinational design center model with multiple successful tape-outs to advanced logic foundries such as TSMC. • Familiarity with the full cycle of SoC development, from architectural spec development to frontend and backend design, verification, and post-silicon bring-up. • Experience working with IP providers and seamlessly integrating complex IP from third parties into the SoC, ensuring smooth pre-silicon and post-silicon engagement. This includes PHY, memory controllers, NOC, microcontrollers, MBIST, interfaces, adapters, RAS, buffers, etc., for various memory types (DDR, LPDDR, HBM).s • Experience across full RTL to GDS flow including RTL development, design verification, DFT, physical design. • Proficiency with various EDA tools from Cadence, Synopsys, Siemens, etc. • Experience with programming languages and scripting (e.g., Verilog, VHDL, SystemVerilog, Python). • Knowledge of industry standards and compliance requirements (e.g., JEDEC, ISO 26262, etc). Preferred Qualifications • Minimum 15 years of experience in a related field & a bachelor’s degree in a relevant field. • Experience in project management methodologies. • Strong collaboration, adaptability, and effective communication skills. • Ability to work in a fast-paced, dynamic environment and manage multiple priorities. The US base salary range that Micron Technology estimates it could pay for this full-time position is: $193,000.00 - $391,000.00 a year Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Keywords: Micron Technology, Euless , Director, HBM SoC Design, Engineering , Richardson, Texas